Pathway arrangement

ABSTRACT

Components embodiments that can sustain and condition complementary energy propagations and confluences of multiple circuitry.

[0001] This application is a continuation-in-part of co-pendingapplication Ser. No. 10/115,159, filed Apr. 2, 2002, which is acontinuation-in-part of co-pending application Ser. No. 09/845,680,filed Apr. 30, 2001, which is a continuation-in-part of co-pendingapplication Ser. No. 09/815,246 filed Mar. 22, 2001, which is acontinuation-in-part of co-pending application Ser. No. 09/777,021 filedFeb. 5, 2001, which is a continuation-in-part of co-pending applicationSer. No. 09/594,447 filed Aug. 3, 2000, which is a continuation-in-partof co-pending application Ser. No. 09/594,447 filed Jun. 15, 2000, whichis a continuation-in-part of co-pending application Ser. No. 09/579,606filed May 26, 2000, now issued as U.S. Pat. No. 6,373,673, which is acontinuation-in-part of co-pending application Ser. No. 09/460,218 filedDec. 13, 1999, now issued as U.S. Pat. No. 6,331,926, which is acontinuation of application Ser. No. 09/056,379 filed Apr. 7, 1998, nowissued as U.S. Pat. No. 6,018,448, which is a continuation-in-part ofapplication Ser. No. 09/008,769 filed Jan. 19, 1998, now issued as U.S.Pat. No. 6,097,581, which is a continuation-in-part of application Ser.No. 08/841,940 filed Apr. 8, 1997, now issued as U.S. Pat. No.5,909,350.

[0002] In addition, this application claims the benefit of U.S.Provisional Application No. 60/302,429, filed Jul. 2, 2001, U.S.Provisional Application No. 60/310,962, filed Aug. 8, 2001.

TECHNICAL FIELD

[0003] This application relates to balanced shielding arrangements thatuse complementary relative groupings of energy pathways, such aspathways for various energy propagations for multiple energyconditioning functions. These shielding arrangements may be operable asdiscrete or non-discrete embodiments that can sustain and conditionelectrically complementary energy confluences.

BACKGROUND

[0004] Today, as the density of electronics within applicationsincreases, unwanted noise byproducts of the increased density may limitthe performance electronic circuitry. Consequently, the avoidance of theeffects of unwanted noise byproducts, such as by isolation orimmunization of circuits against the effects of the undesirable noise isan important consideration for circuit arrangements and circuit design.

[0005] Differential and common mode noise energy may be generated by,and may propagate along or around, energy pathways, cables, circuitboard tracks or traces, high-speed transmission lines, and/or bus linepathways. These energy conductors may act as, for example, an antennathat radiates energy fields. This antenna-analogous performance mayexacerbate the noise problem in that, at higher frequencies, propagatingenergy utilizing prior art passive devices may experience increasedlevels of energy parasitic interference, such as various capacitiveand/or inductive parasitics.

[0006] These increases may be due, in part, to the combination ofconstraints resulting from functionally or structurally limitations ofprior art solutions, coupled with the inherent manufacturing or designimbalances and performance deficiencies of the prior art. Thesedeficiencies inherently create, or induce, unwanted and unbalancedinterference energy that may couple into associated electricalcircuitry, thereby making at least partial shielding from theseparasitics and electromagnetic interference desirable. Consequently, forbroad frequency operating environments, solving these problemsnecessitates at least a combination of simultaneous filtration, carefulsystems layout having various grounding or anti-noise arrangements, aswell as extensive isolating in combination with at least partialelectrostatic and electromagnetic shielding.

[0007] Thus, a need exists for a self-contained, energy-conditioningarrangement utilizing simplified energy pathway arrangements, which mayadditionally include other elements, amalgamated into a discreet ornon-discreet component, which may be utilized in almost any circuitapplication for providing effective, symmetrically balanced, andsustainable, simultaneous energy conditioning functions selected from atleast a decoupling function, transient suppression function, noisecancellation function, energy blocking function, and energy suppressionfunctions.

BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Understanding of the present invention will be facilitated byconsideration of the following detailed description of the preferredembodiments of the present invention taken in conjunction with theaccompanying drawings, in which like numerals refer to like parts and inwhich:

[0009]FIG. 1 is a relative location compass operable for determiningrelative locations of the various pathway extensions disclosed;

[0010] FIGS. 1A-1C show relative locations of the various pathwayextensions disclosed according to an aspect of the present invention;

[0011]FIG. 2A shows a circuit schematic of the plan view of anembodiment of 2B according to an aspect of the resent invention;

[0012]FIG. 2B is a plan view of an embodiment according to an aspect ofthe present invention;

[0013]FIG. 3A shows a circuit schematic of the plan view of anembodiment of 3B according to an aspect of the present invention;

[0014]FIG. 3B is a plan view of an embodiment according to an aspect ofthe present invention;

[0015]FIG. 3C shows a plan view of a shield according to an aspect ofthe present invention;

[0016]FIG. 4A shows a relative plan view of an embodiment according toan aspect of the present invention;

[0017]FIG. 4B shows a relative plan view of an embodiment according toan aspect of the present invention;

[0018]FIG. 4C shows a relative plan view of an embodiment according toan aspect of the present invention;

[0019]FIG. 4D shows a relative plan view of an embodiment according toan aspect of the present invention;

[0020]FIG. 4E shows a relative plan view of an embodiment according toan aspect of the present invention;

[0021]FIG. 4F shows a relative plan view of an embodiment according toan aspect of the present invention;

[0022]FIG. 4G shows a relative plan view of an embodiment according toan aspect of the present invention;

[0023]FIG. 4H shows a relative plan view of an embodiment according toan aspect of the present invention;

[0024]FIG. 4I shows a relative plan view of an embodiment according toan aspect of the present invention;

[0025]FIG. 5A shows a stacked multiple, circuit network including groupsof pathways according to an aspect of the present invention;

[0026]FIG. 5B shows a stacked shield according to an aspect of thepresent invention;

DETAILED DESCRIPTION

[0027] This application is a continuation-in-part of co-pendingapplication Ser. No. 10/115,159, filed Apr. 2, 2002, which is acontinuation-in-part of co-pending application Ser. No. 09/845,680,filed Apr. 30, 2001, which is a continuation-in-part of co-pendingapplication Ser. No. 09/815,246 filed Mar. 22, 2001, which is acontinuation-in-part of co-pending application Ser. No. 09/777,021 filedFeb. 5, 2001, which is a continuation-in-part of co-pending applicationSer. No. 09/594,447 filed Aug. 3, 2000, which is a continuation-in-partof co-pending application Ser. No. 09/594,447 filed Jun. 15, 2000, whichis a continuation-in-part of co-pending application Ser. No. 09/579,606filed May 26, 2000, now issued as U.S. Pat. No. 6,373,673, which is acontinuation-in-part of co-pending application Ser. No. 09/460,218 filedDec. 13, 1999, now issued as U.S. Pat. No. 6,331,926, which is acontinuation of application Ser. No. 09/056,379 filed Apr. 7, 1998, nowissued as U.S. Pat. No. 6,018,448, which is a continuation-in-part ofapplication Ser. No. 09/008,769 filed Jan. 19, 1998, now issued as U.S.Pat. No. 6,097,581, which is a continuation-in-part of application Ser.No. 08/841,940 filed Apr. 8, 1997, now issued as U.S. Pat. No.5,909,350, each of which is incorporated by reference herein.

[0028] In addition, this application claims the benefit of U.S.Provisional Application No. 60/302,429, filed Jul. 2, 2001, U.S.Provisional Application No. 60/310,962, filed Aug. 8, 2001, each ofwhich is incorporated by reference herein.

[0029] It is to be understood that the figures and descriptions of thepresent invention have been simplified to illustrate elements that arerelevant for a clear understanding of the present invention, whileeliminating, for the purpose of clarity, many other elements found intypical energy conditioning systems and methods. Those of ordinary skillin the art will recognize that other elements and/or steps are desirableand/or required in implementing the present invention. However, becausesuch elements and steps are well known in the art, and because they donot facilitate a better understanding of the present invention, adiscussion of such elements and steps is not provided herein. Thedisclosure herein is directed to all such variations and modificationsto such elements and methods known to those skilled in the art.Additionally, it will be apparent to those skilled in the art that termsused herein that may include a whole, or a portion of a whole, such as“energy”, “system”, circuit, and the like, are contemplated to includeboth the portions of the whole, and the entire of the whole, as used,unless otherwise noted.

[0030] As used herein, an “energy pathway” or “pathway” may be at leastone, or a number, of conductive materials, each one operable forsustained propagation of energy. Pathways may be conductive, therebybetter propagating various electrical energies as compared tonon-conductive or semi-conductive materials directly or indirectlycoupled to, or adjacent to, the pathways. An energy pathway mayfacilitate propagation of a first energy by allowing for various energyconditioning functions, such as conditioning functions arising due toany one or a number of aspects, such as, but not limited to, theshielding, the orientation and/or the positioning of the energy pathwayswithin the energy pathway arrangement, which various arrangements havingan orientation and/or positioning thereby allow for interaction of thefirst energy with propagating energies that are complementary to atleast the first energy. An energy pathway may include an energy pathwayportion, an entire energy pathway, a conductor, an energy conductor, anelectrode, at least one process-created conductor, and/or a shield. Aplurality of energy pathways may include a plurality of each device orelement discussed hereinabove with respect to energy pathway. Further,as used generally herein, a conductor may include, for example, anindividual conductive material portion, a conductive plane, a conductivepathway, a pathway, an electrical wire, a via, an aperture, a conductiveportion such as a resistive lead, a conductive material portion, or anelectrical plate, such as plates separated by at least one medium 801,for example.

[0031] A shield may include a shielding electrode, a shielding pathwayportion, a shielded pathway, a shielded conductor, a shielded energyconductor, a shielded electrode, and/or at least one process-createdshielded pathway portion. A plurality of shields may include a pluralityof the devices discussed hereinabove with respect to a shield.

[0032] As used generally herein, a pathway may be complementarypositioned, or complementary orientated, with respect to a main-body 80,81, having various pathway extensions, designated 79“X”, 812“X”, 811“X”and 99“X”. Main-bodies 80, 81 may be in three-dimensional physicalrelationships individually, in pairs, groups, and/or pluralities as todistance, orientation, position, superposition, non-superposition,alignment, partial alignment, lapping, non-lapping, and partial lapping.Superposed main-body pathway 80, may, for example include a pairing ofphysically opposing and oppositely orientated main-body pathways 80 thatare any one of, or any combination of, electrically null, electricallycomplementary, electrically differential, or electrically opposite.

[0033] A pathway arrangement may include at least a shield at leastpartially shielding at least one energy pathway, or a group of shieldsforming a shield structure that at least partially shielding, via aconductive shielding, at least a conductively isolated pairing of atleast two energy pathways, such as vias, apertures or complementarypaired pathways.

[0034] In an illustrative pathway arrangement illustrated in FIGS. 1A,1B, 1C, 5A and 5B, wherein the various propagating energies may becomplementary, the pathway arrangement, upon placement into a circuitarrangement, may allow for energy propagation within or along certainenergy pathways of the pathway arrangement, thereby allowing for themutual interaction of opposite portions of pathway-soured magneticfields produced by the propagation of energy field currents emanatingoutwardly from each set of the complementary conductors. This mutualinteraction maybe a mutual cancellation in embodiments wherein certainpathways may be partially or totally physically shielded from othercomplementary pathways, and may be placed within an influencing distanceof those other complementary pathways. Further, a substantial similarityin size and shape of the respective complementary pathways, includingthe spaced-apart relationship and the interpositioning of a shieldingbetween pathways, and the conductively isolated relationship of thepathways, may contribute to this mutual cancellation effect.Additionally, the shielding operations may be predicated on a relativepositioning of a mating of the paired pathways relative to theconductive electrostatic shielding. At least the complementary energyconditioning functions and electrostatic shielding dynamics discussedherein may operate on various energy propagating in various directionsalong various predetermined pathways, and may operate on circuits havingdynamic operation utilizing the pathway arrangement.

[0035] A sub-combination of electromagnetically/electrostaticallyactuated impedance states may develop along or within a pathwayarrangement, or along or within a closely coupled external conductiveportion conductively coupled to separate or multiple groupings ofshields, to thereby form an energy conditioning circuit. Theseelectromagnetically/electrostatically actuated impedance states maydevelop, for example, because of the energization of one paired set ofpathways of one circuit portion, but not necessarily develop on anotherpaired set of pathways from another circuit portion, for example.

[0036] According to an aspect of the present invention, each shield mayinclude a main-body 81. Main-bodies 81 may collectively and conductivelycouple to one another and at the same time may substantially immure andshield the main-body 80 of the energy pathways. In other embodiments ofthe present invention, the collective shielding main-body 81 may onlypartially immure or shield the pathway main-body 80 s in at least oneportion of the shielding.

[0037] According to an aspect of the present invention, a balanced,symmetrical, pathway arrangement may result from the symmetry of certainsuperposed shields, from complementary pathway sizing and shaping,and/or from reciprocal positioning and pairing of the complementarypathways. Manufacturable balanced or symmetrical physical arrangementsof pathways, wherein dynamic energy propagation, interactions, pairingsor match-ups of various dynamic quantities occur, may operate at lessthan a fundamental limit of accuracy of testing equipment. Thus, whenportions of these complementary energy quantities interactsimultaneously, the energy may be beyond the quantifiable range of thetypical testing equipment. Thus, the extent to which the measurement maybe obtained may employ increased controllability, and thereby theelectrical characteristics and the effect on electrical characteristicsmay be controlled, such as by predetermining the desired measurability,behavior or enhancement to be provided, and by a correspondentarrangement of the elements, such as specifically by an arrangement ofthe elements to provide the desired measurability or effect. Forexample, a desired electrical characteristic may be predetermined for adesired enhancement by varying at least a portion of the complementarybalance, size, shape, and symmetry of at least one pathway paring, asset forth herein below and as illustrated in FIGS. 1A, 1B, 1 C, 5A and5B, for example.

[0038] Thus, the extent of energy interactions, mutual energypropagation timings and interferences, for example, may be controlled bytolerances within the pathway arrangement. A manufacturing process, orcomputer tolerance control, such as semiconductor process control, maycontrol these tolerances, for example. Thus, the pathways of anembodiment may be formed using manufacturing processes, such as passivedevice processes, apparent to those skilled in the art. Mutual energypropagation measurements may thereby be cancelled or suppressed by theformation, and process of formation, of the pathway arrangement.

[0039] A pathway arrangement may, as set forth hereinabove, include asequentially positioned grouping of pathways in an amalgamatedelectronic structure having balanced groupings of pathways. The balancedgrouping may include a predetermined pathway architecture having astacked hierarchy of pathways that are symmetrical and complementary innumber, and that are positioned complementary to one another, therebyforming pairs, each of which pair is substantially equidistant from eachside of a centrally positioned shield, wherein each shield may provide asymmetrical balancing point for both each pair pathway and the overallpathway hierarchy as depicted in FIGS. 1A to 4I, for example. Thus,predetermined identically sized, shaped and complementary positionedpathways may be present on either side of a centrally positioned shieldfor each separate circuit portion. A total circuit may have itscomplementary portions symmetrically divided into a complementaryphysical format including a reverse-mirror image positioning of pairedshielded, complementary sized and shaped pathways, sandwiching at leastone interposing shield.

[0040] According to an aspect of the present invention, each pathway maybe, for example, a first interconnect substrate wrapping around, orholding, an integrated circuit wafer, a deposit, an etching, or aresultant of a doping process, and the shield may be, for example, apathway substrate, an energy conditioning embodiment or energyconditioning substrate, a deposit, an etching, a resultant of a dopingprocess, and may have, for example, resistive properties. Additionalelements may be utilized, including conductive and nonconductiveelements, between the various pathways. These additional elements maytake the form of ferromagnetic materials or ferromagnetic-likedielectric layers, and/or inductive-ferrite dielectric derivativematerials. Additional pathway structural elements may be utilized,including conductive and nonconductive multiple pathways of differentconductive material compositions, conductive magnetic field-influencingmaterial hybrids and conductive polymer sheets, various processedconductive and nonconductive laminates, straight conductive deposits,multiple shielding pathway pathways utilizing various types of magneticmaterial shields and selective shielding, and conductively doped andconductively deposited on the materials and termination solder, forexample, in addition to various combinations of material and structuralelements, to provide a host of energy conditioning options.

[0041] Non-conductor materials may also provide structural support ofthe various pathways, and these non-conductor materials may aid theoverall energized circuit in maintaining the simultaneous, constant anduninterrupted energy propagation moving along the pathways. Dielectricmaterials for example, may include one or more layers of materialelements compatible with available processing technology. Thesedielectric materials may be a semiconductor material such as silicon,germanium, gallium arsenide, or a semi-insulating and insulatingmaterial such as, but not limited to any K, high K and low Kdielectrics.

[0042] Pathway and conductor materials may be selected from a groupconsisting of Ag, Ag/Pd, Cu, Ni, Pt, Au, Pd and other such conductivematerials and metals. Combinations of these metal materials are suitablefor the purposes discussed herein, and may include appropriate metaloxides, such as ruthenium oxide, which, depending on the exigencies of aparticular application, may be diluted with a suitable metal. Otherpathways may be formed of a substantially non-resistive conductivematerial. Any substances and processes that may create pathways fromconductive, non-conductive, semi-conductive material, and/or Mylar filmsprinted circuit board materials, or any substances or processes that maycreate conductive areas such as doped polysilicons, sinteredpolycrystallines, metals, polysilicon silicates, or polysilicon silicidemay be used within or with the pathway arrangement.

[0043] An exemplary embodiment of the present invention may utilize aninternal shield structural architecture to insure energy balancingconfigurations within the various arrangements, rather than a specificexternal circuit balance. This balancing configuration is dependent uponthe relative positioning of all the shields in relationship to theshared and centrally positioned shield, and the actual paired shieldspositioned in specific quantities, to simultaneously provide shieldingfor the electrically opposing shielded paired pathways utilized bypropagating energy. This allows these electrically opposingcomplementary pathways to be located both electrically and physically onthe opposite sides of the centrally positioned and shared commonconductive shield. This interposition of the central and shared shieldsmay create a voltage divider that divides various circuit voltages inhalf and that provides, to each of the oppositely paired shieldedconductors, one half of the voltage energy normally expected. Theenergized circuitry, including shielded conductors, may be balancedelectrically or in a charge-opposing manner and with respect to acentrally positioned shield, to a common and shared pathway, or to eachrespective, isolated circuit system portion. Each common circuit memberof an isolated circuit system may be attached or coupled to a commonarea or common pathway, thereby providing an external common zerovoltage. Thus, the embodiment may have multiple sets of shieldselectrically or physically located between at least one of the variouselectrically or charge opposing, shielded pairs or grouped complementarypairs of pathways in an interposed shielding relationship, supportedwith additional outer sandwiching shields, designated herein as -IM thatare additionally coupled and, in part, form the shielding structure.

[0044] An exemplary embodiment may also be placed into one or moreenergy circuits that utilize different energy sources and that maysupply one or more separate and distinct energy-utilizing loads. Whenenergized for multiple energy conditioning operations and for providingsimultaneous and effective energy conditioning functions, such aselectromagnetic interference filtering, suppression, energy decouplingand energy surge protection, each separate and distinct circuit isutilizing the multiple commonly shared universal shield structure andcircuit reference image, or node.

[0045] According to an aspect of the present invention,energy-conditioning functions may maintain an apparent balanced energyvoltage reference and energy supply for each respective energy-utilizingload within a circuit. This energized arrangement may allow for specificenergy propagation utilizing a single, or multiple, isolated pathwayarrangement, and may not require balancing on a single, centralizedshield. A shield may be physically and electrically located between oneor multiple energy sources and one or multiple energy utilizing loads,depending upon the number of separate and isolated pathways. Thusshielding relative, centralized pathways may be in both co-planar andstacked variants of exemplary embodiment.

[0046] When the internally positioned paired shielded pathways aresubsequently attached, or conductively coupled, to externallymanufactured pathways, the internally positioned paired shields may besubstantially enveloped within the cage-like shield structure, therebyminimizing internally generated energy strays and parasitics that maynormally escape or couple to an adjacent shielded pathway. Theseshielding modes utilize propagating energy to the various pathways andmay be separate of the electrostatic shield effect created by theenergization of the shield structure. The propagating energy propagatingin a complementary manner provides energy fields of mutually opposed,mutually cancelled fields as a result of the close proximity of oppositepropagation. The complementary and paired pathways may provide aninternally balanced opposing resistance load function.

[0047] In an exemplary embodiment, perimeter conductive couplingmaterial for coupling or connecting, by conductive joining, of externalportions of a typical embodiment into an assembly may be accomplished byconductive or non-conductive attachments to various types of angled,parallel or perpendicular, as those terms apply relative to at leastanother pathway, conductors known as apertures or blind or non-blindVIAs, passing through, or almost through, portions respectively of anexemplary embodiment. Couplings to at least one or more load(s), such asa portion of an integrated circuit, for one aspect of the invention mayinvolve a selective coupling, or not, to these various types ofconductors, such as apertures and VIAs.

[0048] Fabricating a pathway may include forming one or more platedthrough hole (PTH) via(s) through one or more levels of a pathway.Electronic packages commonly include multiple interconnect levels. Insuch a package, the invention may include layerings of patternedconductive material on one interconnect level that may be electricallyinsulated from patterned conductive material on another interconnectlevel, such as by dielectric material layers.

[0049] Connections or couplings between the conductive material at thevarious interconnect levels may be made by forming openings, referred toherein as vias or apertures, in the insulating portions or layers, thatin turn can provide an electrically conductive structure such that thepatterned or shaped conductive material portions or pathways fromdifferent levels are brought into electrical contact with each other.These structures can extend through one or more of the interconnectlevels. Use of conductive, non-conductive or conductively-filledapertures and VIAs allows propagating energy to transverse an exemplaryembodiment as if utilizing a by-pass or feed-through pathwayconfiguration of an embodiment. An embodiment may serve as a support, asystem or a subsystem platform that may contain both or either activeand passive components layered to provide the benefits described forconditioning propagated energy between at least one source and at leastone load.

[0050] An aspect of the present invention may provide a conductivearchitecture or structure suitable for inclusion in a packaging or anintegrated circuit package having other elements. Other elements may bedirectly coupled to the device for simultaneous physical and electricalshielding by allowing simultaneous energy interactions to take placebetween grouped and energized complementary conductors that are fed byother pathways. Typical capacitive balances found between at least oneshielding pathway may be found when measuring opposite sides of theshared shield structure per isolated circuit, and may be maintained atmeasured capacitive levels within this isolated circuit portion, evenwith the use of common non-specialized dielectrics or pathway conductivematerials. Thus, complementary capacitive balancing, or tolerancebalancing characteristics, of this type of electrical circuit due toelement positioning, size, separations and attachment positioning allowan exemplary embodiment having an isolated circuit system manufacturedat 3% capacitive tolerance, internally, to pass to a conductivelycoupled and energized isolated circuit system a maintained andcorrelated 3% capacitive tolerance between electrically opposing andpaired complementary pathways of each respective isolated circuitsystem, with respect to the dividing shield structures placed into theisolated circuit system.

[0051] An exemplary embodiment may allow utilization of relativelyinexpensive dielectrics, conductive materials and various other materialelements in a wide variety of ways. Due to the nature of thearchitecture, the physical and electrical dividing structure created mayallow the voltage dividing and balancing among the grouped, adjacentelements, and may allow for the minimization of the effect of materialhysteresis and piezoelectric phenomenon to such a degree thatpropagating energy normally disrupted or lost to these effects may beessentially retained in the form of active component switching responsetime, as well as instantaneous ability to appear to the variousenergy-utilizing loads as an apparent open energy flow simultaneously onboth electrical sides of a pathway connecting or coupling from an energysource to a respective load, and from the load back to the source.

[0052] A structured layer may be shaped, buried within, enveloped by, orinserted into various electrical systems and sub-systems to perform lineconditioning or decoupling, for example, and to aid in or to allow for amodifying of an electrical transmission of energy to a desired orpredetermined electrical characteristic. Expensive, specialized,dielectric materials that attempt to maintain specific or narrow energyconditioning or voltage balancing may no longer be needed for bypass,feed through, or energy decoupling operations for a circuit.

[0053] A device according to an aspect of the present invention may, asset forth hereinabove, be placed between each isolated circuit and apaired plurality of pathways or differential pathways. This exemplarydevice may operate effectively across a broad frequency range, ascompared to a single discrete capacitor or inductor component, and maycontinue to perform effectively within an isolated circuit systemoperating beyond, for example, a GHz.

[0054] As set forth hereinabove, the exemplary device may performshielding functions in this broad frequency range. A physical shieldingof paired, electrically opposing and adjacent complementary pathways mayresult from the size of the common pathways in relationship to the sizeof the complementary pathways, and from the energized, electrostaticsuppression or minimization of parasitics originating from thesandwiched complementary conductors and preventing external parasitics.Further, the positioning of the shielding, relative to shielding that ismore conductive, may be used to protect against inductive energy and“H-Field” coupling. This technique is known as mutual inductivecancellation.

[0055] Parasitic coupling is known as electric field coupling. Theshielding function discussed hereinabove provides primary shielding ofthe various shielded pathways electrostatically against electric fieldparasitics. Parasitic coupling involving the passage of interferingpropagating energy because of mutual or stray parasitic energyoriginating from the complementary conductor pathways may be therebysuppressed. A device according to an aspect of the present inventionmay, for example, block capacitive coupling by enveloping oppositelyphased conductors in the universal shield architecture with stackedconductive hierarchical progression, thereby providing an electrostaticor Faraday shield effect with respect to the pathway positioning as tothe respective layering and position, both vertically and horizontally,of the pathways. The shielding pathway architecture may be used tosuppress and prevent internal and external parasitic coupling betweenpotentially noisy conductors and victim conductors, such as by animposition of a number of common pathway layers that are larger than thesmaller paired complementary pathways, but that are positioned betweeneach of the complementary pathway conductor pairs to suppress and tocontain the stray parasitics.

[0056] Further, as set forth hereinabove, positioning of the shielding,relative to shielding that is more conductive, may be used againstinductive energy and “H-Field” coupling. This cancellation isaccomplished by physically shielding energy, while simultaneously usinga complementary and paired pathway positioned to allow for the insettingof the contained and paired complementary pathways within an area sizecorrespondent to the shield size. A device according to an aspect of thepresent invention is adapted to use shields separately as internalshields or groupings, thereby substantially isolating and sandwichingpairs of electrically opposing complementary pathways, and therebyproviding a physically tight or minimized energy and circuit looppropagation path between each shield and the active load. Closeproximity of shields and non-shields may allow energy along shields evenif a direct electrical isolation exists because of 801 material type orthe spacing. Flux cancellation of propagating energy along paired andelectrically opposing or differential pathways may result from spacingof pathways apart by a very small distance for oppositely phasedelectrically complementary operations, thereby resulting in asimultaneous stray parasitic suppression and containment functionattributable to tandem shielding, and thereby enhancing energyconditioning.

[0057] In attaining minimum areas for various current loops in anisolated circuit system, additional shielding energy currents may bedistributed around component shielding architectures. A plurality ofshields as described hereinabove may be electrically coupled as eitheran isolated circuit's reference node, or chassis ground, and may berelied on as a commonly used reference pathway for a circuit. Thus, thevarious groups of internally paired, complementary pathways may includepropagating energy originating from one or more energy sourcespropagating along external pathways coupled to the circuit by aconductive material. Energy may thus enter the device, undergoconditioning, and continue to each respective load.

[0058] The shielding structure may allow for a portion of a shield tooperate as the pathway of low impedance for dumping and suppressing, aswell as at least partially blocking return of unwanted electromagneticinterference noise and energy into each of the respective energizedcircuits. In an embodiment, internally located shields may beconductively coupled to a conductive area, thereby adaptively utilizingshielding structure for low impedance dumping and suppressing and atleast partially blocking return blocking of unwanted electromagneticinterference noise and energy. Additionally, another set of internallylocated shields may be conductively coupled to a second conductive area,thereby utilizing shields for low impedance dumping, suppressing and atleast partially blocking the return of unwanted electromagneticinterference noise and energy. The conductive areas may be electricallyor conductively isolated from one another.

[0059] Simultaneous suppression of energy parasitics may be attributedto the enveloping shielding pathway structure, in combination with thecancellation of mutually opposing energy fields, and may be furtherattributed to the electrically opposing shielded pathway pathways andpropagating energy along the various circuit pathways interacting withinthe various isolated circuits to undergo a conditioning effect takingplace upon the propagating energy. This conditioning may includeminimizing effects of H-field energy and E-field energy throughsimultaneous functions, such as through isolated circuits that containand maintain a defined electrical area adjacent to dynamic simultaneouslow and high impedance pathways of shielding in which various pairedpathways have their respective potentials respectively switching as aresult of a given potential located on a shielding and usedinstantaneously and oppositely by these pairings with respect to theutilization by energy found along paired routings of the low and highimpedance shields.

[0060] The various distance relationships created by the positionaloverlapping of energy routings within the isolated circuits combine withthe various dynamic energy movements to enhance and cancel the variousdegrees of detrimental energy disruptions normally occurring withinactive components or loads. The efficient energy conditioning functionsoccurring within the passive layering architecture allow for developmentof a dynamic “0” impedance energy “black hole”, or energy drain, along athird pathway coupled common to both complementary pathways and adaptedto allow energy to be contained and dissipated upon the shielding,within the various isolated circuits and attached or conductivelycoupled circuits. Thus, electrically opposing energies may be separatedby dielectric material and/or by an interposition shield structure,thereby allowing dynamic and close distance relationship within aspecific circuit architecture, and thereby taking advantage ofpropagating energy and relative distances to allow for exploitation ofmutual enhancing cancellation phenomenon and an electrostaticsuppression phenomenon to exponentially allow layered conductive anddielectric elements to become highly efficient in energy handlingability.

[0061] According to an aspect of the present invention, a device mayutilize a single low impedance pathway or a common low impedance pathwayas a voltage reference, while utilizing a circuit maintained andbalanced within a relative electrical reference point, therebymaintaining minimal parasitic contribution and disruptive energyparasitics in the isolated circuit system. The various attachmentschemes described herein may allow a “0” voltage reference, as discussedhereinabove, to develop with respect to each pair or plurality of pairedcomplementary conductors located on opposite sides of the shared centralshield, thereby allowing a voltage to be maintained and balanced, evenwith multiple Simultaneous Switching Operations states among transistorgates located within an active integrated circuit, with minimaldisruptive energy parasitics in an isolated circuit.

[0062] Shields may be joined using principals of a cage-like conductiveshield structure to create one or more shieldings. The conductivecoupling of shields together with a larger external conductive area maysuppress radiated electromagnetic emissions and as a larger areaprovides a greater conductive area in which dissipation of voltages andsurges may occur. One or more of a plurality of conductive or dielectricmaterials having different electrical characteristics may be maintainedbetween shields. A specific complementary pathway may include aplurality of commonly conductive structures performing differentiallyphased conditioning with respect to a “mate”, or paired, plurality ofoppositely phased or charged structures forming half of the total sum ofmanufactured complementary pathways, wherein one half of thecomplementary pathways forms a first plurality of pathways, and whereinthe second half forms a second plurality of pathways. The sum of thecomplementary pathways of the first and the second plurality of pathwaysmay be evenly separated electrically, with an equal number of pathwaysused simultaneously, but with half the total sum of the individualcomplementary pathways operating from, for example, a range of 1 degreeto approximately 180 degrees electrically out of phase from theoppositely positioned groupings. Small amounts of dielectric material,such as microns or less, may be used as the conductive materialseparation between pathways, in addition to the interposing shield,which dielectric may not directly physically or conductively couple toany of the complementarily operating shielded pathways.

[0063] An external ground area may couple or conductively connect as analternative common pathway. Additional numbers of paired externalpathways may be attached to lower the circuit impedance. This lowimpedance phenomenon may occur using alternative or auxiliary circuitreturn pathways.

[0064] A shield architecture may allow shields to be joined together,thereby facilitating energy propagation along a newly developed lowimpedance pathway, and thereby allowing unwanted electromagneticinterference or noise to move to this created low impedance pathway.

[0065] Referring now to FIGS. 1A through FIG. 5B, which generally showvarious common principals of both common and individual variants of anexemplary embodiment configured in a co-planar variant (FIGS. 1A-4I) anda stacked variant (FIGS. 5A and 5B).

[0066] In FIG. 1A, there are shown relative locations of the variouspathway extensions disclosed according to an aspect of the presentinvention. A portion of a relative balanced andcomplementary-symmetrical arrangement utilizing a center shieldingpathway designated 8“XX”-“X”M is adapted in the arrangement as thefulcrum of balanced conductive portions in a co-planar variant. Apathway arrangement including at least a first and a second plurality ofpathways, wherein the first plurality has at least one pair of pathwaysarranged electrically isolated from each other and orientated in a firstcomplementary relationship, is illustrated. Additionally, at least afirst half of the second plurality is arranged electrically isolatedfrom a second half of the second plurality, wherein at least twopathways of the second plurality are electrically isolated from thepathways of first plurality. The pathway arrangement may also include amaterial having properties, such as dielectric, ferromagnetic, orvaristor for example, spacing apart pathways of the pathway arrangement.The pathways of the first half of the second plurality are electricallycoupled to one another, and the pathways of the second half of thesecond plurality are electrically coupled to one another. A total numberof pathways of the first half of the second plurality may be an oddnumber greater than one, and a total number of pathways of a second halfof the second plurality may also be an odd number greater than one.According to an aspect of the present invention, the pathways of thefirst half of the second plurality are positioned in a first superposedalignment, while the pathways of the second half of the second pluralityare positioned in a second superposed alignment, with the first andsecond superposed alignments in a mutual superposed alignment hereindefined as a co-planar arrangement.

[0067] In a non co-planar arrangement, the pathways of the first half ofthe second plurality may be positioned in a first superposed alignment,and the pathways of the second half of the second plurality may bepositioned in a second superposed alignment, with the first and secondsuperposed alignments in arrangement one atop the other. In onearrangement, at least four pathways are electrically isolated.

[0068] An illustrative embodiment of the present invention may includeat least three pluralities of pathways, including a first plurality ofpathways and a second plurality of pathways. The first and secondpluralities of pathways may include pathway members of the firstplurality having an equal and opposite pathway member found in thesecond plurality of pathways. Members of the first and secondpluralities of pathways may be substantially the same size and shape,and may be positioned complementary, and may also operate in anelectrically complementary manner. Thus, the pairings of the first andsecond pluralities of pathways may result in identical numbers ofmembers of the first and second pluralities of pathways. An exemplaryembodiment may provide at least a first and a second shield allowing fordevelopment of individual isolated low circuit impedance pathways.Structurally, the shields may be accomplished by a third plurality ofpathways and a fourth plurality of pathways. Each shielding pluralitymay include shields of equal size and shape. Each of the third andfourth plurality of pathways may be conductively coupled. Conductivecoupling may be accomplished by a variety of methods and materials knownto those possessing an ordinary skill in the pertinent arts. Thus, whenthe third and a fourth plurality are grouped as two sets of shieldsutilizing the first and second plurality receiving shielding, the thirdand fourth pluralities may be coupled to a common pathway to develop alow circuit impedance pathway for energy propagation for conditioning ofthe circuit energy.

[0069] Pathways may additionally be arranged in a bypass arrangement,such that when placed face to face, main-body pathways 80 may be alignedsuperposed, with the exception of any pathway extensions such as 812NNE,811NNE, 812SSW and 811SSW of the lower sub-circuit portion, for example,shown as mirror images depicted in FIG. 5A and FIG. 5B, for example.

[0070] Within the pluralities, individual pathway members may be ofsubstantially the same size and shape and may be conductively coupled.However, individual pathway members of one plurality may not beconductively coupled to members of a different plurality of pathways.There may be situations wherein members of one plurality may beconnected to members of a different plurality, such as wherein a firstplurality of shields and a second plurality of shields are externallycoupled to the same conductor.

[0071] Common elements may include energy flow in accordance withconceptual energy indicators 600, 601, 602, 603 depicting the dynamicenergy movements in co-planar shielded by-pass pathways, such as thoseshown in FIGS. 1A-1C. An embodiment may provide for at least multipleshields for development of multiple isolated low circuit impedancepathways for multiple circuits.

[0072] Referring still to FIG. 1A, pathways may be shielded by therelative, common pathways, and may include a main-body pathway 80 withat least one pathway extension 812“X”. The shields shown include amain-body shield pathway 81 with at least one pathway extensiondesignated 99“X”/79“X”. The shields may sandwich and envelope themain-body 799, including a conductive inner pathway formed of conductivematerials from the family of noble or base metals traditionally used inco-fired electronic components or conductive material, such as Ag,Ag/Pd, Cu, Ni, Pt, Au, Pd, or combination materials such as metal oxideand glass frit. A capacitance and a resistance value may be achieved inone family of pathways, as described hereinabove, such as by use ofruthenium oxide as the resistive material and Ag/Pd as the conductivematerial. Further, variations in pathway geometry may yield differentresistance and capacitance values. Variations may be achieved byaltering the materials from which the pathways are made. For example, aconductive metal, such as silver, may be selectively added to the metaloxide/glass frit material to lower the resistance of the material.

[0073] A plurality of pathways, 865-1 and 865-2, are shown positionedco-planar and spaced apart on a same portion of material 801. Eachpathway of the co-planar pathways 865-1 and 865-2, may be formed ofconductive material 799, or a hybrid of conductive material and anothermaterial, herein designated as 799“x”. Each co planar pathway 865-1 and865-2 may also be formed as a bypass pathway, wherein each pathwayincludes a main-body pathway 80 having a corresponding main-body edgeand perimeter, 803A and 803B, respectively and at least one pathwaycontiguous extension 812“X”. Each co-planar pathway 865-1 and 865-2, mayinclude at least one pathway contiguous extension 812SSW and 811SSW witha portion of the main-body edge 803A and 803B extending therefrom.Extension 812“X” is a portion of the pathway material formed inconjunction with a main-body pathway 80 from which it extends. Main-bodypathway 80, an 812“X” may be found as an extension of material 799 or799“x” extending beyond an accepted average perimeter edge 803“X”.Extensions 812“X” and 79“X” may be found respectively positioned as acontiguous portion of the pathway from which it is formed. Eachmain-body pathway may have edge 803A, 803B positioned relative andspaced apart a distance 814F from the embodiment edge 817. Embodimentedge 817 may include a material 801. Co-planar main-body pathway's edge803“x” may be positioned and spaced apart a distance 814J. Pathwayextensions 812SSW and 811SSW may conductively couple a respectivepathway main-body 80 to an outer pathway 890SSW and 891SSW, which may bepositioned at edge 817. The co-planar arranged, main-body pathway 80 maybe positioned “sandwiched ” between the area of registered coverage oftwo layering of co-planar, main-body pathway 81 s.

[0074] Combining mutually opposing fields causes a cancellation orminimization effect. The closer the complementary, symmetricallyoriented shields, the better the resulting mutually opposingcancellation effect on opposing energy propagation. The more superposedthe orientation of the complementary, symmetrically oriented shields is,the better the resulting suppression of parasitics and cancellationeffect.

[0075] Referring still to FIG. 1A, the edges of the plurality ofco-planar shields may be represented by dotted lines 805A and 805B.Main-body pathways 81 of each of the plurality of shields are largerthan a sandwiching main-body pathway 80 of any corresponding sandwichedpathway. This may create an inset area 806 relative to the positions ofthe shields and remaining pathways. The size of main-bodies 80 and 81may be substantially similar, and thus the insetting positioningrelationships may be minimal in certain embodiments. Increased parasiticsuppression may be obtained by insetting pathways, including a main-body80, to be shielded by larger pathway main-body 81 s. For example, aninset of a main-body 80 of pathways 865-1 inset may be separated adistance of 1 to 20+times the spacing provided by the thickness of thematerial 801 separating pathway 865-1 and adjacent center co-planarpathway 800-IM-1, as illustrated in FIG. 1B. In another embodiment aninset of a main-body 80 of pathways 865-1 inset may be about 1 to about20+times an approximate thickness of one of an energy pathway of anembodiment such as pathway 865-1, for example.

[0076] Plurality of co-planar shield edges 805A and 805B may bepositioned and spaced apart a distance 814K, and may be a distance 814relative to edges 805A and 805B and the edge 817. Other distances 814Jrelative from either edges 803A and 803B may be provided. Further,distance 814F may be present between one 803“X” and an edge 817. Eachcoplanar shield may include a plurality of contiguous pathway extensionportions, such as, for example, portions 79NNE, 79SSE, 99NNE and 99SSE,extending from the plurality of coplanar shield edges 805A and 805B.Plurality of co-planar shields may include a plurality of outer pathwaymaterial 901NNE, 901SSE, 902NNE and 902SSE positioned at the edge 817.Conceptual energy indicators 602 represent the various dynamic energymovements within the co-planar pathways 865-1 and 865-2. Unwanted energymay be transferred to the coplanar shields in accordance with theprovision by the shields providing for a low impedance pathway, whichshields may additionally be electrically coupled to another pathway orconductive area.

[0077] Referring now to FIGS. 1B and 1C, layer sequences are illustratedfor a first plurality of co-planar pathways 865-1, 865-2, a secondplurality of co-planar pathways 855-1, 855-2, and a third plurality ofco-planer pathways 825-1-IM, 825-2-IM, 815-1, 815-2, 800-1-IM, 800-2-IM,810-1, 810-2, and 820-1-IM, 820-2-IM. The first, second, and thirdpluralities may be stacked to form an embodiment 3199, 3200, 3201. Thethird plurality of co-planar pathways may provide shielding. Main-bodies81 of the plurality of co-planer shields 825-1-IM, 825-2-IM; 815-1,815-2; 800-1-IM, 800-2-IM; 810-1, 810-2; and 820-1-IM, 820-2-IM may besubstantially similar in size and shape, and may be spaced apart inco-planar locations on different layers of material 801. The firstplurality of co-planar pathways 865-1 and 865-2 may have at least thecorresponding, opposing, and complementary second plurality of co-planarpathways 855-1 and 855-2. These first and second pluralities ofco-planar pathways, when oriented face to face, may have main-bodypathways 80 s co-registered and aligned except for the variouscontiguous pathway extensions 812“X”, 811“X”. As shown in FIGS. 1B and1C, a pair of outer co-planar pathways 820-1-IM, 825-1-IM may serve aspathway shields, thereby improving the shielding effectiveness of theother conductively coupled pluralities of pathways with a main-body 81s.

[0078] As illustrated in the varied embodiments 3199, 3200, 3201, thelocation of extensions 79NNE, 79SSE, of shields 825-1-IM, 815-1,800-1-IM, 810-1, and 820-1-IM and extensions 99NNE, 99SSE of the shields825-2-IM, 815-2, 800-2-IM, 810-2, and 820-2-IM, may be varied. In FIG.1B, for example, extensions 79NNE and 99NNE may be arranged spacedapart, diagonally from extensions 79SSE and 99SSE and on opposite sidesof shield main-body 81. In FIG. 1C, for example, extensions 79NNE and99NNE may be arranged spaced apart in line with extensions 79SSE and99SSE on opposite sides of shield main-body 81. In FIG. 1B, extensions812NNE and 811NNE may be arranged spaced apart, extending toward thesame edge 812 of layer of material 801, and extensions 812SSW and 811SSWmay be arranged spaced apart, each extending toward the opposite edge812 of layer of material 801. In FIG. 1C, pathways 865-1 and 865-2 maybe mirror images, as discussed hereinabove. Comparably to FIG. 1B,extensions 812NNE and 811NNE may be arranged spaced apart, extendingtoward opposite edges 817 of layer of material 801. Extensions 812SSWand 811SSW may be arranged spaced apart, extending toward the oppositeedge of layer of material 801, such that extensions 812NNE and 811SSWextend toward opposite edges 812“X” of the respective layer of material801.

[0079] Referring now to FIGS. 2A and 2B, FIG. 2A illustrates a schematicplan view of a an embodiment of FIG. 2B according to an aspect of thepresent invention. FIG. 2B depicts a pathway arrangement including alayout of a first, a second, a third, a fourth, a fifth, a sixth, aseventh, a eighth, a ninth and a tenth pathway, wherein at least thethird and the fourth pathway, for example, may be co-planar and arrangedspaced apart from each other. FIG. 2B illustrates the first and thesecond pathway arranged below the third and the fourth pathway, and thefifth and the sixth pathway arranged above the third and the fourthpathway, and the seventh and the eighth pathway arranged above the fifthand the sixth pathway, and the ninth and the tenth pathway, arrangedabove the seventh and the eighth pathway. These pathways have variousrespective internal contiguous pathway extensions 812“X”, 811“X”, 79“X”and 99“X”, and may be discrete components having the same minimalnumbers of layering. Internal contiguous pathway extensions 812“X”, 811“X”, 79“X” and 99“X”, and conductively coupled external pathways 890“X”,891“X” 802“X” and 902“X”, may be coupled to the inner pathway of theplurality of co-planar pathways of the main-body pathway 80 and 81.

[0080] Referring now to FIGS. 3A and 3B, in FIG. 3A there is shown aschematic plan view of an embodiment of FIG. 3B, wherein outer pathwaysmay be selectively conductively coupled in at least two isolated circuitportions. FIG. 3B depicts an pathway arrangement including a minimallayout of a first, a second, a third, a fourth, a fifth, a sixth, aseventh, a eighth, a ninth and a tenth pathway, wherein at least thethird and the fourth pathway, for example, are co-planar and arrangedspaced apart from each other. The device shown in FIG. 3B may have thefirst and the second pathway arranged below the third and the fourthpathway, and the fifth and the sixth pathway arranged above the thirdand the fourth pathway, and the seventh and the eighth pathway arrangedabove the fifth and the sixth pathway, and the ninth and the tenthpathway arranged above the seventh and the eighth pathway. Thesepathways have various respective internal contiguous pathway extensions812“X”, 811 “X”, 79“X” and 99“X”, and may be discrete components havingthe same minimal number of layering.

[0081] Referring now to FIG. 3C, a plan view of a shield according to anaspect of the present invention is illustrated. The embodiment depictedin FIG. 3C includes at least one additional pathway, as compared to thedevice of FIG. 3B. This additional pathway 1100-IM“X” may be one of atleast a plurality of shields in the stack of pathways, which shields mayspan across the two circuit portions. Pathway 1100-IM“X” may be one ofat least two outer sandwiching shields in the stack of pathways. Shieldsmay span across the two circuits by adding a centrally arranged1100-IM“X” pathway electrically coupled to the outer 1100-IM“X” shields.Pathways 1100-IM“X” may have at least one extension, and are illustratedwith two extensions 1099NNE and 1099SSE, and may allow for sandwichingshields for all of the pathways within the present invention. At leastthree shields may be coupled together and may include a centering shielddividing an energy load or energy source of an isolated circuit ordividing two isolated circuits.

[0082] A shield 00GS may be electrically isolated from other shields andmay be arranged to effect an energy propagation of an isolated circuit.An isolated circuit may be sandwiched by a shield. A shield may beelectrically coupled to a conductive area that is isolated from anyother conductive areas thereby effecting an energy propagation.

[0083] FIGS. 4A-4I depict assembled components of various embodimentsaccording to aspects of the present invention. The arrangements of FIG.4A to FIG. 4I may include minimal layouts of a first, a second, a third,a fourth, a fifth, a sixth, a seventh, a eighth, a ninth and a tenthpathway, wherein at least the third and the fourth pathway, for example,are co-planar and arranged spaced apart from each other. The first andthe second pathway may be arranged below the third and the fourthpathway, and the fifth and the sixth pathway may be arranged above thethird and the fourth pathway, and the seventh and the eighth pathway maybe arranged above the fifth and the sixth pathway, and the ninth and thetenth pathway may be arranged above the seventh and the eighth pathway.These pathways have various respective internal contiguous pathwayextensions 812“X”, 811“X”, 79“X” and 99“X”, and may be an assembledfinal discrete component, for example.

[0084] Referring to FIG. 5A, there is shown a stacking of multiple,non-shared circuits including groups of pathways according to an aspectof the present invention. Included in FIG. 5A is a marker 1000 showing acontinuation of the stacking arrangement to the next column of FIG. 5A.Conceptual energy indicators 600, 601, 602, 603 indicate energy flow.Material 799 may be deposited on material 801 for component 6900 shieldsdesignated 8151, 800-1, 810-1-IM, 815-2, 800-2-IM, and 810-2. Shields810-A and 810-B are separated shields of at least part of an isolatedcircuit system. Shields 815-A and -B are separated shields of at leastpart of an isolated circuit system. Shields 820-A and 820-B areseparated shields at least part of an isolated circuit system. Shields825-A and 825-B are separated shields at least part of an isolatedcircuit system. Conductors 855-1 and 855-2 are separated and shieldedpathways in bypass configuration. Conductors 865-1 and 865-2 areseparated and shielded pathways in bypass configuration. In FIG. 5A, apathway arrangement is depicted including at least six orientations ofpathways of two types of pathways, wherein each orientation of thepathways of the at least six orientations of pathways providesconductive isolation from the remaining orientations of pathways.

[0085] Referring to FIG. 5B, there is shown a stacked shield structureaccording to an aspect of the present invention. FIG. 5B depicts anembodiment similar to that of FIG. 5A, wherein two sets of 855“X” and865“X” pathways are omitted for purposes of clarity, and wherein theshields of FIG. 5A are oriented in flip-flop for each relative set of855“X” and 865“X” pathways. The 79“X” pathway extensions may be rotated90 degrees relative to the various pathway extensions 811“x” and 812“X”.A dynamic result of this configuration, as illustrated by the conceptualenergy indicators, may be enhanced by nulling the extensions of the twosets of 855“X” and 865“X” pathways of the two isolated circuits, and byrelatively positioning the shield of each isolated circuit pairing 855Aand 865A approximately 90 degrees null to the various pathway extensionsof 855B and 865B.

[0086] As discussed hereinabove, in an embodiment of the presentinvention, multiple complementary or paired shielded pathways mayinclude the first and second pluralities of pathways. Energy may utilizethe various paired, feed-through or bypass pathway layers in a generallyparallel and even manner, for example. Pathway elements may includenon-insulated and conductive apertures, and conductive through-VIAs, toprovide propagating energy and maintain a generally non-parallel orperpendicular relationship, and additionally maintain a separateelectrical relationship with an adjoining circuit. These pathways maymaintain balance internally, and may facilitate an electrical oppositionalong opposing complementary pairings. This relationship amongcomplementary pairs of pathways may occur while the pathways and theenergy are undergoing an opposite operational usage within the shieldingstructure attached externally.

[0087] For stacked variants depicted in FIGS. 5A and 5B, adding threepathways 1100-IM-“X”, including one between 810-1 and 815-2, designatedas 1100-IM-“C”, may bisect a balanced symmetry of the total number ofpathways located into equal numbers on opposite sides of 1100-IM-“C”.The addition of 1100-IM-1 and 1100-IM-2, electrically coupled to1100-IM-C, creates a common or a shield structure (not all shown).Shields of a shield structure may be of substantially the same size ornot. Shields may or may not be physically isolated from any othershields for any one or more embodiments of the present invention. Thus,shields may or may not be electrically or conductively isolated from anyother shields for any one or more embodiments of the present invention.

[0088] An odd number of shields may be coupled together thereby allowingformation of a common reference or node utilizing all other shields. Thenumber of shields 1100-IM-“X” is not confined to using extensions1099NNE and 1099SSE such as shield 00GS, as any number of extensions inalmost any direction may be used to facilitate a coupling. A relativebalanced and complementary-symmetrical arrangement may be formed withrespect to a center shield 8“XX” or shield 800/800-IM for a as thearrangement fulcrum of balanced conductive portions. At least a partialflux field cancellation of energy propagating along or between pairedand electrically opposing complementary pathways occurs in this balancedbut shifted embodiment. Further, simultaneous stray energy parasitics,complementary charged suppression, physical and electrical shieldingcontainment and a faraday effect may also occur. This result is achievedbecause the magnetic flux energies travel at least partially along theshield wherein the RF return path is parallel and adjacent to acorresponding pathway. Thus, the magnetic flux energy may be measured orobserved relative to a return Shifted pathways may be in relativebalance and complementarily and symmetrically positioned with respect tocenter shields, such as shields 800/800-“X”-IM, and may include arelatively shifted, balanced, complementary, and symmetrical arrangementof predetermined shields and pathways complementarily sandwiched arounda centrally positioned shield, such as 800/800-IM, for example.

[0089] The exemplary embodiments of FIGS. 1A, 1B, 1C, through FIG. 4I,for example may include these ‘shifted’ embodiments. These shiftedembodiments may include a multiplicity of layers having a shielding, apathway, a shielding, an pathway, and a shielding. Each of thesemultiplicity of layers may be centered and complementary about a centershield 800/800-“X”IM, such as for co-planar variants, and the entiremultiplicity of layers may be centered about a main center shield.Complementarity and balance may be maintained about the center shield,and the main center shield, although individual shields may be shiftedto create discrete imbalances as between a given matched pathway pair,for example. Shifting may expose a portion of at least one pathwayoutside the perimeter of the superposed shielding, thereby allowing forparasitics and thereby varying, for example, impedance characteristics.

[0090] For example, a given pathway may be shifted 5 points to the left.This shifting may be accounted for in the matched pairs about a centershield, and, consequently, either an adjacent matched pair pathway ofopposing polarity may be shifted 5 points, or 5 adjacent pathways ofopposite polarity may each shift 1 point, thereby maintainingcomplementarity and balance. Further, pathways may remain within theperimeter of the superposed shielding, and nonetheless be shiftedthereunder. Such a shifting under the shielding may, nonetheless, makedesirable a balancing. However, certain exemplary embodiments not shownmay include situations wherein pathways are pulled toward the center ofa shield, and remain under the shield evidencing differing electricalcharacteristics, such as inductive behavior, in a balanced or unbalancedstate.

[0091] Referring now to FIG. 4A thru to FIG. 5B, the terminationelectrodes 890A, 890B, and 891A, 891B, 802GA, 802GB, and 902GA, 902GB,may be monolithic or multi-layered. Termination electrodes 802GA, 802GB,902GA, 902GB, may be located at other respective portions of a sinteredbody. Each main body electrode layers 81 or 80, and the associateelectrode extensions 99/79G“X” or 812“X”, may define an electrode whichextends to, and conductively couples to, the associated terminationelectrodes 802GA, 802GB, 902GA, 902GB and 890A, 890B, and 891A, 891B.

[0092] The present invention may be utilized for many energyconditioning functions that utilize commonly coupled shielding structureelement for emulating a center tap of resistor/voltage divider network.This resistor/voltage divider network may be normally constructed usinga ratio of various integrated circuit resistors. However, variousintegrated circuit resistors may be replaced by a device according to anaspect of the present invention, the device utilizing, for example,specific conductive/resistive materials 799A or naturally occurringresistance properties of pathway material 799, or utilizing a variedphysical layout. A voltage dividing function may be present as portionsof a common and shared pathway shield structure are utilized to define acommon voltage reference located at both respective sides of the commonpathway shield structure.

[0093] In embodiments, whether initially stacked vertically during amanufacturing process, or in combination with a co-planar pairings asdescribed hereinabove, the number of complementary pathways pairings maybe multiplied in a predetermined manner to create a number of pathwayelement combinations of a generally physically or electrically parallelnature.

[0094] Further, although not shown, a device of the present inventionmay be fabricated in silicon and directly incorporated into integratedcircuit microprocessor circuitry or microprocessor chip packaging. Anysuitable method for depositing electrically conductive materials may beused, such as plating, sputtering, vapor, electrical, screening,stenciling, vacuum, and chemical including chemical vapor deposition(CVD).

[0095] While certain embodiments have been herein described in positionas “upper” or “above”, or “lower” or “below”, or any other positional ordirectional description, it will be understood that these descriptionsare merely relative and are not intended to be limiting.

[0096] The present invention may be implemented in a number of differentembodiments, including a energy conditioning embodiment as an energyconditioner for an electronic assembly, an energy conditioningsubstrate, an integrated circuit package, an electronic assembly or anelectronic system in the form of a energy conditioning system, and maybe fabricated using various methods. Other embodiments will be readilyapparent to those of ordinary skill in the art.

What is claimed:
 1. A component comprising: a first plurality of firstenergy pathways, including at least two first energy pathwayssubstantially electrically isolated from, and electricallycomplementarily oriented with respect to, one another; and, a secondplurality of second energy pathways, including at least two secondenergy pathways substantially electrically isolated from said firstenergy pathways, and wherein at least one second energy pathway issubstantially electrically isolated from at least one other of saidsecond energy pathways of said second plurality.
 2. The component ofclaim 1, wherein said second plurality of energy pathways comprises atleast one substantially shielding pathway.
 3. The component of claim 1,wherein said at least one second energy pathway is electrically coupledto at least one other second energy pathway of said second plurality,and wherein said at least one second energy pathway substantiallyelectrically isolated from said at least one other second energy pathwayof said second plurality is electrically coupled to at least one othersecond energy pathway of said second plurality.
 4. The component ofclaim 1, further comprising a spacer for spacing apart at least one ofsaid first energy pathways from at least one of said second energypathways.
 5. The component of claim 4, wherein said spacer comprisessubstantially a dielectric.
 6. The component of claim 5, wherein saiddielectric comprises air.
 7. The component of claim 4, wherein said atleast one second energy pathway is aligned in a first superposedorientation with said at least one other second energy pathway of saidsecond plurality, and wherein said at least one second energy pathwaysubstantially electrically isolated from said at least one other secondenergy pathway of said second plurality is positioned in a secondsuperposed orientation with at least one additional other second energypathway of said second plurality.
 8. The component of claim 7, whereinsaid first superposed orientation and said second superposed orientationare aligned superposed.
 9. The component of claim 1, wherein fourpathways selected from at least said first and second pluralities areeach substantially electrically isolated from each other.
 10. Anelectronic component comprising: at least a first plurality of pathways;and, a second plurality of pathways, including at least two of saidsecond plurality of pathways being electrically isolated from each ofsaid first plurality; wherein said first plurality comprises at leastone pair of first plurality pathways electrically isolated from eachother and arranged mutually complementarily; wherein at least a firstgrouping of second plurality pathways is arranged substantiallyelectrically isolated from a second grouping of second pluralitypathways; wherein said first grouping is electrically coupled together;and wherein said second grouping is electrically coupled together. 11.The electronic component of claim 10, further comprising a spacer forspacing apart at least two pathways.
 12. The electronic component ofclaim 11, wherein said spacer comprises a dielectric.
 13. The electroniccomponent of claim 10, wherein at least four pathways selected from atleast said first and second pluralities are substantially electricallyisolated from each other.
 14. The electronic component of claim 10,wherein at least six pathways selected from at least said first andsecond pluralities are substantially electrically isolated from eachother.
 15. The electronic component of claim 10, wherein said secondplurality comprises at least two second plurality pathways arrangedsubstantially respectively co-planar.
 16. The electronic component ofclaim 10, wherein said first and second pluralities are arranged in anon co-planar stack.
 17. The electronic component of claim 10, whereinsaid second plurality of pathways comprises a plurality of substantiallyshielding pathways.
 18. An electronic component, comprising: a firstplurality of shields conductively coupled together; at least a secondplurality of shields conductively coupled together, and electricallyisolated from said first plurality; a plurality of paired electrodes,wherein each pair comprises two electrically opposing electrodes;wherein each of said shields and each of said paired electrodes arealternately arranged; and wherein any one pair of said paired electrodesis electrically isolated from any other pair of said paired electrodes,and wherein the any one pair is sandwiched by one of at least two ofsaid first plurality of shields and at least two of said secondplurality of shields.
 19. The electronic component of claim 18, whereinsaid first and said second pluralities of shields are respectivelyisolated from one another and in a substantially coplanar relationship.20. The electronic component of claim 18, further comprising a thirdplurality of shields; and wherein said first and said second pluralitiesof shields are conductively isolated from said third plurality ofshields.
 21. The electronic component of claim 18, wherein said firstand said second pluralities of shields are respectively conductivelyuncoupled and in a substantially non-coplanar relationship.
 22. Theelectronic component of claim 18, wherein said first and said secondpluralities of shields are respectively conductively coupled and in asubstantially non-coplanar relationship.
 23. The electronic component ofclaim 18, wherein one of said first or said second plurality of shieldscomprises a centering one of said shields, and wherein said first andsaid second pluralities of shields and said paired electrodes arearranged in a substantially balanced and complementary symmetricalarrangement about said centering one.
 24. The electronic component ofclaim 18, wherein one of said first or said second plurality of shieldscomprises a centering one of said shields, and wherein said first andsaid second pluralities of shields and said paired electrodes aresubstantially aligned about said centering one.
 25. The electroniccomponent of claim 24, wherein at least one of said shields and at leastone of said paired electrodes are respectively shifted about saidcentering one.
 26. The electronic component of claim 18, wherein one ofsaid first or said second plurality of shields comprises a centering oneof said shields, and wherein said first and said second pluralities ofshields and said paired electrodes in a substantially shiftedarrangement about said centering one.
 27. The electronic component ofclaim 18, wherein each of said shields and said electrodes aresubstantially equivalent in shape.
 28. The electronic component of claim27, wherein each of said shields and said electrodes are substantiallyequivalent in size.
 29. The electronic component of claim 27, whereineach of said shields is larger in size than each of said electrodes. 30.The electronic component of claim 29, wherein each of said shields islarger in size than each of said electrodes in a range of about 1 toabout 20 times an approximate thickness of one of said electrodes. 31.The electronic component of claim 27, wherein at least one of saidshields envelops at least one of said electrodes.
 32. The electroniccomponent of claim 18, wherein each of said shields and each of saidelectrodes comprises at least one extending portion.
 33. The electroniccomponent of claim 32, wherein each of said shields and each of saidelectrodes comprises at least one contiguous extending portion.
 34. Theelectronic component of claim 33, wherein at least two of said at leastone contiguous extending portions extend diagonally.
 35. The electroniccomponent of claim 33, wherein at least two of said at least onecontiguous extending portions extend linearly.
 36. The electroniccomponent of claim 32, wherein each of said shield extending portions atleast partially provides said conductively coupling.
 37. The electroniccomponent of claim 32, wherein each of said electrode extending portionsat least partially provides said conductively coupling.
 38. Theelectronic component of claim 32, wherein said extending portions ofsaid first plurality of shields are substantially aligned.
 39. Theelectronic component of claim 38, wherein said extending portions ofsaid second plurality of shields are substantially aligned.
 40. Theelectronic component of claim 38 wherein said extending portions of saidelectrodes are substantially aligned.
 42. The electronic component ofclaim 32, wherein said extending portions of said first plurality ofshields and said second plurality of shields are unaligned.
 43. Theelectronic component of claim 32, wherein said extending portions of atleast one of said first plurality of shields and said second pluralityof shields, and said extending portions of said plurality of electrodes,are unaligned.
 44. The electronic component of claim 18, wherein saidfirst plurality of shields comprises an odd number of shields.
 45. Theelectronic component of claim 44, wherein said first plurality ofshields includes at least three shields.
 46. The electronic component ofclaim 18, wherein said second plurality of shields comprises an oddnumber of shields.
 47. The electronic component of claim 46, whereinsaid second plurality of shields includes at least three shields.
 48. Acomponent comprising: at least a first and a second plurality ofpathways; wherein said first plurality further comprises at least twopathways arranged electrically isolated from each other and orientatedin a first complementary relationship; wherein at least a first numberof pathways of said second plurality is arranged electrically isolatedfrom a second number of pathways of said second plurality; and whereinthe at least two pathways of said second plurality are electricallyisolated from said first plurality.
 49. The component of claim 48,wherein pathways of said first number of pathways of said secondplurality are electrically coupled to one another; and wherein pathwaysof said second number of pathways of said second plurality areelectrically coupled to one another.
 50. The component of claim 48,wherein said first number of pathways of said second plurality is an oddnumber greater than one; wherein said second number of pathways of saidsecond plurality is an odd number greater than one; wherein pathways ofsaid first number of pathways of said second plurality are electricallycoupled to one another; and wherein pathways of said second number ofpathways of said second plurality are electrically coupled to oneanother.
 51. The component of claim 49, further comprising a materialhaving properties; and wherein said material at least spaces apart twopathways of said component.
 52. The component of claim 50, furthercomprising a material having properties; and wherein said material atleast spaces apart two pathways of said component.
 53. The component ofclaim 51, wherein said first number of pathways of said second pluralityare positioned in a first alignment; and wherein said second number ofpathways of said second plurality are positioned in a second alignment.54. The component of claim 52, wherein said first number of pathways ofsaid second plurality are positioned in a first superposed alignment;and wherein said second number of pathways of said second plurality arepositioned in a second superposed alignment.
 55. The component of claim53, wherein the first alignment and the second alignment are in asuperposed alignment.
 56. A component of claim 54, wherein the first andthe second superposed alignment are in position at least one on top ofthe other.
 57. The component of claim 49, wherein pathways of said firstnumber of pathways are arranged electrically coupled to one another in afirst alignment; wherein pathways of said second number of pathways arearranged electrically coupled to one another in a second alignment;wherein said first number of pathways is an odd number of pathwaysgreater than one, and wherein said second number of pathways is an oddnumber of pathways greater than one; and wherein a total number ofpathways of said first plurality is at least an even number greater thantwo.
 58. The component of claim 51, wherein pathways of said firstnumber of pathways of said second plurality are arranged in a firstsuperposed alignment electrically coupled to one another; whereinpathways of said second number of pathways of said second plurality arearranged in a second superposed alignment electrically coupled to oneanother; wherein a total number of pathways of second plurality is anodd number greater than one; and wherein a total number of pathways ofsaid first plurality is at least an even number greater than two. 59.The component of claim 57, further comprising a material havingproperties; and wherein said material at least spaces apart pathways ofsaid component.
 60. A component of claim 58, wherein four pathways ofthe component are electrically isolated from one another.
 61. Acomponent comprising: at least a first and a second plurality ofpathways; wherein the first plurality has at least one pair of pathwayselectrically isolated from each other and arranged in mutualcomplementary position; wherein at least a first number of pathways ofsaid second plurality is arranged electrically isolated from a secondnumber of pathways of said second plurality, and said second pluralityhas at least two pathways electrically isolated from said firstplurality; wherein pathways of said first number of pathways of saidsecond plurality are electrically coupled to one another; and whereinpathways of said second number of pathways of said second plurality areelectrically coupled to one another.
 62. The component of claim 61,further comprising a material having properties; and wherein saidmaterial at least spaces apart pathways of said component.
 63. Acomponent of claim 61, wherein at least four pathways of the componentare electrically isolated from one another.
 64. A component of claim 61,wherein at least six pathways of the component are electrically isolatedfrom one another.
 65. A component of claim 61, wherein said secondplurality has at least two pathways arranged co-planar to one another;and wherein at least four pathways of the component are electricallyisolated from one another.
 66. A component of claim 61, wherein saidsecond plurality has at least two pathways arranged co-planar to oneanother; and wherein at least four pathways of the component areelectrically isolated from one another.
 67. A component of claim 61,wherein said first and said second plurality are arranged in a nonco-planar stacking; and wherein four pathways of the component areelectrically isolated from one another.
 68. A component of claim 61,wherein said first plurality of pathways is a plurality of shieldedpathways; and wherein said second plurality of pathways is a pluralityof shielding pathways.
 69. A component of claim 61, in which said firstplurality of pathways is a plurality of shielded pathways.
 70. Acomponent of claim 61, in which said second plurality of pathways is aplurality of shielding pathways.